OPC Foundation announces plans to standardize OPC UA for Devices (DI) through IEC
April 1, 2012;
The OPC Foundation plans to standardize OPC UA for Devices (DI) through the International Electrotechnical Commission (IEC). The OPC Foundation is requesting member companies to consider volunteering to participate in this new working group.
Matthias Damm (ascolab) as graciously volunteered to be the chair of this group; Ingo Weber (Siemens) has been nominated to replace Hans-Peter Otto (who is retiring from Siemens) to be the convener for the IEC work.
For more information Information & Registration.
Before starting the IEC work, the OPC UA for Devices working group will review the FDI information model to identify elements that are universally usable and could become part of DI. These elements would then be "moved" from the FDI specification to DI. This movement is the main topic for this release step. Additional enhancements will be considered.
The review and identification of FDI elements will start in April and shall be finished by end of June. The update of OPC UA for Devices will follow and shall be finished in September 2012.
Volunteers interested and able to participate on this work item are welcome. Participation is open to any employee or representative of an OPC Foundation Member company with good knowledge of OPC UA.
An electronic Kick-off meeting will be held on April 27. Details about the meeting may be found here:Information & Registration.
If you have additional questions please contact email@example.com.